printed circuit 印制电路 O
#5`mo
printed wiring 印制线路 juEH$7N!
printed board 印制板 glZjo
printed circuit board 印制板电路 `=E4J2"
printed wiring board 印制线路板 D
4<,YBvV
printed component 印制元件 H(DI /"N
printed contact 印制接点 f<vZ4 IU
printed board assembly 印制板装配 ~Hvf"bvK|
board 板 'h>CgR^NM1
rigid printed board 刚性印制板 d[sY]
_ dj
flexible printed circuit 挠性印制电路 6f&qtJQ<A
flexible printed wiring 挠性印制线路 {=, +;/0
flush printed board 齐平印制板 3PEW0b*]Pf
metal core printed board 金属芯印制板 >Slu?{l'
metal base printed board 金属基印制板 uk)D2.eS,
mulit-wiring printed board 多重布线印制板 FIpJ>E"n
molded circuit board 模塑电路板 Cd7l+~*Y
discrete wiring board 散线印制板 xi=Qxgx0I
micro wire board 微线印制板 0-8'.C1v
buile-up printed board 积层印制板 `,
)%<}
surface laminar circuit 表面层合电路板 ?xtP\~
B2it printed board 埋入凸块连印制板 S0tPnwco[~
chip on board 载芯片板 6G<gA>V
buried resistance board 埋电阻板 /t_AiM,(
mother board 母板 Wh1'?#
daughter board 子板 M]A!jWtE
backplane 背板 'Sjt*2blq
bare board 裸板 h"On9
copper-invar-copper board 键盘板夹心板 E{}Vi>@V?
dynamic flex board 动态挠性板 Kp%:\s,lO
static flex board 静态挠性板 AMc`qh
break-away planel 可断拼板 ]%Z7wF</
cable 电缆 qfsu# R
flexible flat cable (FFC) 挠性扁平电缆 fE,Io3
membrane switch 薄膜开关 lq}g*ih
hybrid circuit 混合电路 jC_m0Iwc
thick film 厚膜 ?<6yKxn
thick film circuit 厚膜电路 }-H)jN^
thin film 薄膜 nD\H$5>5
thin film hybrid circuit 薄膜混合电路 2+cpNk$
interconnection 互连 M*2
Nq=3
conductor trace line 导线 O#?@'1
flush conductor 齐平导线 LsO}a;t5
transmission line 传输线 #Fz/}lO
crossover 跨交 p} {H%L
edge-board contact 板边插头 # p2`9o
stiffener 增强板 G_<4% HM
substrate 基底 V.Tn1i-v
real estate 基板面 k$ b)
conductor side 导线面 9g]%}+D
component side 元件面 OX%#8Lx
solder side 焊接面 -Aojk8tc
printing 印制 L9-Jwy2(>
grid 网格 $JUkwsc
pattern 图形 QO^V@"
N
conductive pattern 导电图形 %P D}VF/Y
non-conductive pattern 非导电图形 ]YtN6Rq/
legend 字符 '%wSs,HD
mark 标志 q/@+
.q
base material 基材 df$.gP
laminate 层压板 LWm1j:0
metal-clad bade material 覆金属箔基材 ZnRT$
l O
copper-clad laminate (CCL) 覆铜箔层压板 D\b$$z]q
composite laminate 复合层压板 ((+XzV>
thin laminate 薄层压板 aq
N{@|
basis material 基体材料 u+r!;-0i
prepreg 预浸材料 X':FFD4h
bonding sheet 粘结片 M%`CzCL
u
preimpregnated bonding sheer 预浸粘结片 h;jO7+W
epoxy glass substrate 环氧玻璃基板 4F|79U #
mass lamination panel 预制内层覆箔板 bh1$
A
core material 内层芯板 \,G9'c 'u
bonding layer 粘结层 F)hj\aHm k
film adhesive 粘结膜 <3{MS],<<
unsupported adhesive film 无支撑胶粘剂膜 "TJu<O"2
cover layer (cover lay) 覆盖层 c9-$^yno
stiffener material 增强板材 M4C8K{}
copper-clad surface 铜箔面 (kLaXayn
foil removal surface 去铜箔面 ^Lgvey%
unclad laminate surface 层压板面 d-~V.
base film surface 基膜面 .|O T#"LP
adhesive faec 胶粘剂面 H
d|p@$I
plate finish 原始光洁面 z}MxMx
c4h
matt finish 粗面 ^N/d`IAjv
length wise direction 纵向 KmNnW1T
cross wise direction 模向 R&Lqaek&W
cut to size panel 剪切板 t<UJR*R=L
ultra thin laminate 超薄型层压板 s\;/U|P_
A-stage resin A阶树脂 WutPy_L<
B-stage resin B阶树脂 HV~Fe!J_
C-stage resin C阶树脂 Or? )Nlg6x
epoxy resin 环氧树脂
(I$%6JO:
phenolic resin 酚醛树脂 LTe ({6l0
polyester resin 聚酯树脂 8m{e,o2.
polyimide resin 聚酰亚胺树脂 M
c,|C)
bismaleimide-triazine resin 双马来酰亚胺三嗪树脂 Q'n+K5&p
acrylic resin 丙烯酸树脂 @mCe{r*`
melamine formaldehyde resin 三聚氰胺甲醛树脂 qHub+"2
polyfunctional epoxy resin 多官能环氧树脂 =_`q;Tu=
brominated epoxy resin 溴化环氧树脂 S=,czs3N
epoxy novolac 环氧酚醛 RFRXOyGz$
fluroresin 氟树脂 th73eC'
silicone resin 硅树脂 b\0>uU
silane 硅烷 polymer 聚合物 !Wr<T!T
amorphous polymer 无定形聚合物 sY!JB7!j
crystalline polamer 结晶现象 ?L0;,
\-t
dimorphism 双晶现象 k{mBG9[z
copolymer 共聚物 _6fy'%J=U
synthetic 合成树脂 [RKk-8I
thermosetting resin 热固性树脂 QD0x^v8
thermoplastic resin 热塑性树脂 1av#u:jy~>
photosensitive resin 感光性树脂 9^DAlY,x.
epoxy value 环氧值 p^ (Z
dicyandiamide 双氰胺 &iWTf K7
binder 粘结剂
#C }+
adesive 胶粘剂 ym5@SBqIx
curing agent 固化剂 ?,7!kTRH
flame retardant 阻燃剂 [2xu`HT02
opaquer 遮光剂 p>pN?53S
plasticizers 增塑剂 M/Z$?nd_H
unsatuiated polyester 不饱和聚酯 uSYI
X
polyester 聚酯薄膜 1H.;r(c
polyimide film (PI) 聚酰亚胺薄膜 d~_5Jx
polytetrafluoetylene (PTFE) 聚四氟乙烯 Ff0V6j)ji
reinforcing material 增强材料 ^y ', l
glass fiber 玻璃纤维 aBQ --Sz
E-glass fibre E玻璃纤维 =&-.] |t
D-glass fibre D玻璃纤维 <MO40MP
S-glass fibre S玻璃纤维 v(O@~8(I
glass fabric 玻璃布 ,-$%>Uv
non-woven fabric 非织布 3\<(!yY8
glass mats 玻璃纤维垫 E9 #o0Di
yarn 纱线 OH+2)X
filament 单丝 9fSX=PVRmQ
strand 绞股 b{e|~v6&
weft yarn 纬纱 A56aOI=
warp yarn 经纱 vC5 (
denier 但尼尔 x(88Y7o.t
warp-wise 经向 =:'a)o
thread count 织物经纬密度 _9zydtw
weave structure 织物组织 u>-!5=D8
plain structure 平纹组织 2L_ts=
grey fabric 坏布 &Qdd\h#
woven scrim 稀松织物 z_J"Qk
bow of weave 弓纬 >p 7e6%
end missing 断经 (k..ll p~
mis-picks 缺纬 9)QvJ87e@7
bias 纬斜 Ov)rsi
crease 折痕 xgt dmv%
waviness 云织 quU%9m
\S`
fish eye 鱼眼 Xt /muV
feather length 毛圈长 w'.ny<Pe
mark 厚薄段 z_<
7T4
split 裂缝 ![:S~x1
twist of yarn 捻度 |z|5j!Nfh
size content 浸润剂含量 =2)5_/9au
size residue 浸润剂残留量 0: h;ots'
finish level 处理剂含量 av gGz8
size 浸润剂 @o44b!i
couplint agent 偶联剂 7-w
+/fv
finished fabric 处理织物 }&rf'E9
polyarmide fiber 聚酰胺纤维 11X-X
aromatic polyamide paper 聚芳酰胺纤维纸 *u
3K8"XZ
breaking length 断裂长 6g@j,iFy
height of capillary rise 吸水高度 l
K}('7\
wet strength retention 湿强度保留率 2ztP'
whitenness 白度 ceramics 陶瓷 , YTuZS
conductive foil 导电箔 d=xU
f`^
copper foil 铜箔 A$;U*7TJuO
rolled copper foil 压延铜箔 lDCoYX_
annealed copper foil 退火铜箔 deQ0)A 4g
thin copper foil 薄铜箔 .,
o=#
adhesive coated foil 涂胶铜箔 #[qmhU{s
resin coated copper foil 涂胶脂铜箔 ]- " )r
composite metallic material 复合金属箔 Rf^$?D&^
carrier foil 载体箔 )iNMjg
invar 殷瓦 F=7X,hK
foil profile 箔(剖面)轮廓 R9A8)dDz
shiny side 光面 cY8XA6
matte side 粗糙面 ]-QY,
k
treated side 处理面 @}eEV[Lli
stain proofing 防锈处理 4Vl_vTz{i
double treated foil 双面处理铜箔 O'm><a>8
shematic diagram 原理图 Zk,`
Iq
logic diagram 逻辑图 1(%9)).K
printed wire layout 印制线路布设 loRT+u$&
master drawing 布设总图 yP$@~L[!
computer aided drawing 计算机辅助制图 /{1s U}k-
computer controlled display 计算机控制显示 E_q/*}]pE
placement 布局 7gWT[
routing 布线 T`?7z+2A
layout 布图设计 2[Ofa(mkkp
rerouting 重布 jgvzp
simulation 模拟 eOoqH$
i
logic simulation 逻辑模拟 f+cN'jH
E
circit simulation 电路模拟 # a`D6;
timing simulation 时序模拟 C'y4 ~7
modularization 模块化 M}!
qH.W
layout effeciency 布线完成率 4Q!|fn0Sv
MDF databse 机器描述格式数据库 dB)-qL8,2
design database 设计数据库 .kU}x3m
design origin 设计原点 y"Pd>61h
optimization (design) 优化(设计) ;"2VU"
predominant axis 供设计优化坐标轴
bsm/y+R
table origin 表格原点 H|0-Al.{
mirroring 镜像 q`'"+` h
drive file 驱动文件 5Hs
F#
intermediate file 中间文件 `a:3S@n(}
manufacturing documentation 制造文件 ).IyjHY
queue support database 队列支撑数据库 ?;_>BX|Zjl
component positioning 元件安置 a??8)=0|}
graphics dispaly 图形显示 dCS f$5
scaling factor 比例因子 {l5fKVb\C
scan filling 扫描填充 In?#?:Q@&
rectangle filling 矩形填充 ypG*41
region filling 填充域 );VuZsmi
physical design 实体设计 Fz,jnV9=j
logic design 逻辑设计 z)U7
logic circuit 逻辑电路 [8IO0lul+
hierarchical design 层次设计 K&`1{,
top-down design 自顶向下设计 {~&Q"8
}G
bottom-up design 自底向上设计 `s T;\
net 线网 M=uT8JB
digitzing 数字化 "d$~}=a[
design rule checking 设计规则检查 f|q/2}Bqb
router (CAD) 走(布)线器 fF0i^E<
net list 网络表 M.mn9kw`
subnet 子线网 fasWb&~z
objective function 目标函数 R<&Euph
post design processing (PDP) 设计后处理 F0U %m
interactive drawing design 交互式制图设计 ~{Iw[,MJ
cost metrix 费用矩阵 3<r7"/5
engineering drawing 工程图 w"9h_;'C_
block diagram 方块框图 pWRdI_
moze 迷宫 Cb+sE"x]
component density 元件密度 8`*5[ L~~/
traveling salesman problem 回售货员问题 #-
B<u-
degrees freedom 自由度 c/K#W$ l
out going degree 入度 zdJPMNHg
incoming degree 出度 qY-aR;
manhatton distance 曼哈顿距离 *m"@*O'
euclidean distance 欧几里德距离 lJAzG,f
network 网络 ?:vg`m!*
array 阵列 xy>$^/[$
segment 段 1Mq"f7X8
logic 逻辑 FBP #_"z
logic design automation 逻辑设计自动化 K&._fG
separated time 分线 ,f>^q"
separated layer 分层 fX:G;vYn
definite sequence 定顺序 ~Gg19x.#uW
conduction (track) 导线(通道) '6WZi|(a
conductor width 导线(体)宽度 ^y&2N
conductor spacing 导线距离 _=5\ $6
conductor layer 导线层 fK4O
N'[R:
conductor line/space 导线宽度/间距 ]G~u8HPH!m
conductor layer No.1 第一导线层 No/D"S#
round pad 圆形盘 41XX
L$
square pad 方形盘 | i'w"Tz4
diamond pad 菱形盘 ViG-tb
oblong pad 长方形焊盘 ^$\#aTyFK
bullet pad 子弹形盘 a`QKNrA2
teardrop pad 泪滴盘 bMF`KRP2
snowman pad 雪人盘 EPwM+#|e-
V-shaped pad V形盘 h/F,D_O>ZO
annular pad 环形盘 {VrjDj+Xy
non-circular pad 非圆形盘 86\B|!
isolation pad 隔离盘 YV0K&d
monfunctional pad 非功能连接盘 oUwu:&<Orm
offset land 偏置连接盘 /P/S0
back-bard land 腹(背)裸盘 hD:$Sv/H
anchoring spaur 盘址 O
W12m{
land pattern 连接盘图形 vO)nqtw
land grid array 连接盘网格阵列 W1s4[rL!Ht
annular ring 孔环 av1*i3
component hole 元件孔 ^AUmIyf_
mounting hole 安装孔 xcz1(R
supported hole 支撑孔 5M
~\'\;
unsupported hole 非支撑孔 67Ai.3dR
via 导通孔 Z^AACKME
plated through hole (PTH) 镀通孔 16 o3ER
access hole 余隙孔 r9G<HKl
blind via (hole) 盲孔 qU#G
z7/
buried via hole 埋孔 `Y/DttjL
buried blind via 埋,盲孔 x+"~-KO8q$
any layer inner via hole 任意层内部导通孔 Uw5z]Jck
all drilled hole 全部钻孔 $TL~SVHj;{
toaling hole 定位孔 <n>Kc}c
landless hole 无连接盘孔 ?z171X0
interstitial hole 中间孔 WsTbqR)W%
landless via hole 无连接盘导通孔 Lf&p2p?~c
pilot hole 引导孔 3205gI,
terminal clearomee hole 端接全隙孔 :seo0w]
dimensioned hole 准尺寸孔 EkgS*q_
via-in-pad 在连接盘中导通孔 I#zrz3WU
hole location 孔位 k, &