自RoHS指令发布以来,欧盟委员会针对豁免材料陆续发布了8次决议,分别是:2005/717/EC 、2005/747/EC、2006/310/EC、2006/690/EC、2006/691/EC、2006/692/EC、2008/385/EC、2009/443/EC,这些决议中的豁免共计38项。其中两项豁免取消,36项豁免有效实施。
SLc'1{ 第 1 项至第38项豁免如下: hw&R.F ),)]gw71QW 1.小型日光灯中的汞含量不得超过5毫克/灯;(2002/95/EC) #`4ma:Pj Mercury in compact fluorescent lamps not exceeding 5 mg per lamp. NUH# 2.一般用途的直立日光灯中的汞含量不得超过: (2002/95/EC) pJ5Sxgv{;
- 卤化磷酸盐(Halophosphate)< 10毫克 uIvE~<
- 正常的三磷酸盐(Triphosphate wITh normal lifetime)< 5毫克 I.\fhNxHY
- 长效的三磷酸盐(Triphosphate with long lifetime)< 8毫克 ;[@<
, Mercury in straight fluorescent lamps for general purposes not exceeding: Y75,{1\l0 · Halophosphate 10 mg; u#Qd`@p · Triphosphate with normal lifetime 5 mg; e;<=aa)}? · Triphosphate with long lifetime 8 mg. yggQ4y6 3.特殊用途的直式日光灯中的汞含量;(2002/95/EC) g%A
p <iT Mercury in straight fluorescent lamps for special purposes. &la;Vu"dp 4.本附录中未特别提及的其它照明灯中的汞含量; (2002/95/EC) Pz1pEyuL Mercury in other lamps not specifically mentioned in this Annex. >T4.mB7+> 5.阴极射线管(cathode ray tubes)、电子部件(electronic components)和发光管(fluorescent tubes)的玻璃内的铅含量;(2002/95/EC) s7<x~v+^ Lead in glass of cathode ray tubes, electronic components and fluorescent tubes. @%K@oD L 6.钢合金中的铅含量不应该超过0.35%、铝合金中铅含量不应该超过0.4%,铜合金中的铅含量不应该超过4%;(2002/95/EC) y!Q&;xO+! Lead as an alloying element in: `Q*L!/K+ · Steel containing up to 0.35 % lead by weight; Z*QsDS · Aluminium containing up to 0.4 % lead by weight; M
yr [ · Copper alloy containing up to 4 % lead by weight. A5zT^!`[ 7.--高温融化型焊锡中的铅(如:锡铅焊料合金中铅含量超过85%);(2005/747/EC) ]w(i,iJ
--用于服务器(servers),存储器(storage)和存储阵列(storage array systems)和交换、信号产生和传输,以及电信网络管理的网络基础设施设备(network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications)中焊料中的铅;(2005/747/EC) _rK}~y=0
--电子陶瓷产品中的铅(如:高压电子装置);(2005/747/EC) s3W )hU) · Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead). d:6?miMH]t · Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunication. rm NqS+t · Lead in electronic ceramic parts (e.g. piezoelectronic devices). 7%9Sz5z 8.电气连接的触点(electrical contacts)中镉及镉化合物的使用不限,以及91/338/EEC指令禁止以外的镉镀层中的镉;(2005/747/EC) i!<